IMS TECHNOLOGY
FOR CUSTOM POWER MODULES
PRODUCTION LINE & TEST EQUIPMENT
AUREL manufactures all IMS boards in our plant in Italy and performs 100% of AOI test.
Special test like X-ray control can be conducted on samples of each production batch as well as torque strength of power connectors and dielectric breakdown voltage.
Production Line with Vacuum reflow process
Test Station
X-Ray
APPLICATIONS
High-efficiency
inverter
Motor
Drivers
Welding
Machines
High-Power UPS
Photovoltaic
EV Mobility
IMS (Insulated Metal Substrate)
High thermal and electrical performances substrates used for Power Electronic Application.
Typical IMS stack-up
- Top copper thickness from 35 to 500µm and beyond.
- Insulation layer – thermal Conductivity up to 15 W/mK – breakdown Voltage up to 13 Kvac.
- Baseplate aluminum or copper, thickness from 0.5 to 3.0mm.
ASSEMBLY
Components
It is possible to assemble all SMD components, with the following suggestions:
- Resistors and Capacitors: all the sizes equal or bigger than 0402.
- Transistors, Mosfets, diodes: SOT 23, SOT 89, ecc.
- Integrated circuits and SMD connectors: with leads pitch equal or bigger than 1,27 mm.
Custom connections
AUREL can design and manufacture custom power connectors based on specific requirements of space and currents.
AUREL guarantees a break torque up to 14 Nm for power towers.
VOIDS
Thanks to our productions line with vacuum reflow oven we can keep control of voids below components being lower than 3%.
WIRE BONDING DIE ATTACH
Wire bonding is particularly useful in the design of packages with Chip-On-Board (COB) architecture.
This technique uses the surface mount and interconnect capability of IMS in a highly efficient thermal design.
SiC mosfets on top of IMS board