TECHNOLOGIES

THICK FILM HYBRID CIRCUITS

 Thick Film Hybrid Circuits on Alumina

Since 40 years, AUREL is leader in thick film technology. AUREL can design and mass produce Thick Film Hybrid Circuits on Alumina ( Al2O3)  and on Aluminium Nitride (AlN) on complex geometry substrates, also provided with laser made metal coated pass-thru holes. Alumina subtrate high thermal and mechanical stability is extremely suitable for chip & wire components …more

APPLICATIONS
  • Military
  • Avionic
  • Aerospace
  • Biomedical

POWER LIGHTING

Thick film on aluminum

New technology (THIFAL) are now available for thick film technology to produce electronic circuits with interconnection nets directly integrated on the aluminum heat-sink, therefore with no need of added IMS, Alumina, printed circuit (FR4) substrates. This solution assures a better thermal efficiency and a very simple mechanical structure, with significant production cost reduction.

APPLICATIONS
  • Entertainment lights
  • Solar cells (CPV)
  • Automotive
  • Offroad led lighting

POWER RESISTORS

Heating elements and power resistors

AUREL is offering an innovative alternative realized on stainless steel or alumina substrates, in planar or tubular shape that can lead to applications not realizable up to now. Heating elements and power resistors are realized printing on Stainless Ferritic or Austenitic Steel Substrates, an electrically insulating, but thermally conductive, ceramic dielectric layer …more

APPLICATIONS
  • Analysis instrumentation
  • Boiler
  • Coffee machines

SURFACE MOUNT (SMT)

SMD mounting circuits

AUREL is specialized in the SMD mounting circuits and electrical components for small and medium samples. Assembling printed circuits with SMT technology with SMD components with pick and place automatic lines. AUREL is leader in SMT technology and offers to the own clients an expert team dedicated and competitive equipments to achieve in outsourcing mode SMT technology hybrid circuits …more

APPLICATIONS
  • Automotive
  • Biomedical

METAL CORE IMS

Power circuits (Insulated Metal Substrate)

IMS Technology is well suitable for applications where electronics is handling very high currents, up to several hundred Ampere, with need of thermal dissipation and mechanical strenght. The superior ductility of aluminum metal is an advantage during the work-shop mechanical operations and also makes easy the installation of electronic cards onto the thermal dissipation supports …more

APPLICATIONS
  • Automotive
  • Inverters for concentrated photovoltaic (CPV)
  • Lighting

CHIP ON BOARD

Chip on Board

The assembly technology Chip on Board (COB) consists in depositing epoxy or silicon protection on the head of the die component for encapsulating and protecting. The technology chip on board can be used on the radio-frequency field and through a right combination of assembly technologies is applied to many types of substrates …more

APPLICATIONS
  • Avionic
  • Biomedical
  • Sensors
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