CHIP & WIRE BONDING
WHY CHOOSE AUREL AS A PARTNER.
- Decades of Experience
For over 50 years, AUREL has provided customers with strong problem-solving capabilities in professional (Hi-Rel) fields, with a high level of technology and innovation. - Modern Production Equipment
Our production site, consisting of two ISO 7 (10,000 ppm) cleanrooms for a total of 300 m², represents the state of the art in chip-on-board and wire bonding production equipment. - Testing and Process Qualification Equipment
AUREL has equipment and highly qualified personnel to meet even the most complex requirements in terms of testing and test benches.
WIRE BONDING
| FEATURES | BALL BONDING | WEDGE BONDING | RIBBON BONDING |
| Wire shape | Round | Round | Flat (Ribbon) |
| Materials | Au, Cu | Al, Au, Cu | Au, Al, Cu |
| Bonding Orientation | Omnidirectional | Unidirectional | Unidirectional |
| Pitch Capability | Moderate | Fine | Fine |
| Speed | High | Moderate | Moderate |
| Temperature | Elevated | Room temperature (Al), Heated | Room temperature or heated |
| Applications | High-volume ICs | Fine-pitch, RF, Power Modules | High-frequency, Power Modules |
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WIRE BONDING EQUIPMENT
Wire Bonding Technologies
Ball-Wedge, Wedge-Wedge, and Ribbon bonding enable different interconnection methods for semiconductor and package assembly. Wire bonding range from 12,5 µm to 250 µm.
Precision Bonding Equipment
FS Bondtec Series 56i and 53 deliver high accuracy for consistent wire placement in complex electronic architectures.
Versatile Bonding Solutions
TPT HB16 and Hesse & Knipps BJ820 adapt to multiple wire types, ensuring process flexibility and robust connectivity.
WIRE BONDING EQUIPMENT CHARACTERISTICS
HESSE BONDJET BJ820 FULLY AUTOMATIC WEDGE-WEDGE WIRE BONDER.
Typical applications
RF/microwave devices, COB, MCM, hybrids, optoelectronics, automotive.
Compatible Wires & Ribbons
- Wires
Aluminum, Gold: 17.5-50 um (optional: 12.5-75 um) – Copper: 17.5-50 um. - Ribbons
Aluminum, Gold: from 6 um x 35 um to 25 um x 250 um.
Speed
Up to 7 wires per second (e.g. 25 um wire, 1 mm loop, wafer metallization).
Looping
From 70 um to 20 mm, customizable loop shapes.
Fine pitch
40 um inline, 25 um staggered.
Positional repeatability
±1 um (3sigma), interpolated resolution: 20 nm.
Bonding force control
Static and dynamic force (15-150 cN), tolerance ±1 cN.
DIE AND FLIP CHIP ASSEMBLY
Die Attach Fundamentals
Die attach involves securing semiconductor chips onto substrates using adhesives or solder to optimize thermal conductivity and mechanical stability.
Flip Chip Assembly
Flip chip technology mounts chips face-down on carriers, enabling shorter interconnects and enhanced electrical performance in miniaturized packages.
Datacon 2200EVO Capabilities
Datacon 2200EVO facilitates precise multi-chip module assembly, supporting SiP, SoC, and hybrid configurations for advanced integration and reliability.
CONTROLLED ATMOSPHERE SOLDERING
Vacuum Reflow Soldering
Vacuum reflow removes trapped gases, preventing voids and oxidation to achieve void-free, high-reliability solder joints.
Controlled Atmosphere Systems
Nitrogen-purged environments in Unitemp RSS-3X210 minimize oxidation, enhancing joint integrity for sensitive electronics.
Key Equipment Advantages
ATV SRO-700 combines precise thermal profiling and atmosphere control to ensure consistent soldering quality and device reliability.
SURFACE TREATMENTS WITH PLASMA
Plasma Surface Treatment Overview
Plasma treatment cleans and activates surfaces by removing contaminants and increasing surface energy before assembly.
Diener Tetra 100 Equipment Features
The Diener Tetra 100 system delivers uniform plasma exposure, ensuring reproducible surface activation for bonding efficacy.
Enhanced Adhesion and Contamination Reduction
Plasma processing improves adhesion by creating reactive functional groups and effectively reduces organic and particulate surface contamination.
MECHANICAL JOINT TESTING
Pull Test Methodology
Pull tests measure axial bond strength by applying tensile force until wire bond failure, validating adhesion.
Shear Test Approach
Shear tests apply lateral force on die attach or wire bonds to assess resistance to mechanical stress.
Nordson Dage 4000 Precision
Nordson Dage 4000 offers micrometer-level force and displacement measurement ensuring repeatable mechanical integrity evaluation.
OPTICAL AND X-RAY INSPECTION
Optical Microscopy Integration
Combining 2D and 3D microscopy offers high-resolution surface defect mapping and volumetric morphology characterization.
Key Inspection Equipment
Zeiss O-Inspect 322 TL1 and Hirox RH-2000 enable rapid, accurate optical inspections with advanced imaging and measurement features.
X-ray Defect Analysis
Nordson Dage XD7600NT utilizes high-resolution X-rays to non-destructively detect internal voids, cracks, and structural anomalies.
MATERIAL ANALYSIS VIA XRF
XRF Material Verification
X-ray fluorescence rapidly characterizes elemental composition of metals and plastics non-destructively on production lines.
Thermo Scientific Niton XL2
This portable analyzer enables fast, accurate alloy identification and plastic verification ensuring strict compliance with standards.
Process Reliability Enhancement
Using XRF minimizes material mix-ups, supports real-time quality assurance, and strengthens overall manufacturing integrity and traceability.
ENVIRONMENTAL AND PIND TESTING
Environmental Stress Testing
ACS DY110C Climatic Chamber simulates extreme temperatures and humidity to evaluate component durability comprehensively.
PIND Testing Protocols
Spectral Dynamics FeliX system detects particle impact noise, crucial for identifying internal contamination in sealed packages.
Integrative Validation Approach
Combining climatic and PIND testing ensures holistic assessment of device reliability under harsh operational environments.
COMPETITIVE ADVANTAGES AND APPLICATIONS
Technological Sophistication
AUREL integrates automated precision machinery and adaptive process controls enhancing manufacturing complexity management.
Quality Assurance Integration
Multi-tiered real-time monitoring and advanced defect detection embed quality assurance within every production phase.
Diverse High-Tech Applications
Solutions serve power electronics, automotive, aerospace, and medical sectors demanding exceptional reliability and performance.