ALS200
CO2 LASER SYSTEM FOR CUTTING, DRILLING AND SCRIBING
ALS200 is a high accuracy laser system, designed for scribing, drilling and cutting of ceramic substrates for thin and thick film hybrid circuits up to 6”x6” (typical AL₂O₃ and AIN).
The system is equipped with double nozzle for an automatic switching: one for cutting and one for scribing.
ALS200 lasers are offered as basic system (with manual loading/unloading) or with optional handling modules from/to stack or cassette magazine for high volume production.
Fixed head with double nozzle.
Pulse frequency and width programmable and controlled in real time by the electronic control.
Motorized focus for Z-axis adjustment, according to the thickness of the substrate.
DOWNLOAD TECHNICAL DATA SHEET
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FEATURES
CONTROL SYSTEMS
- The machine is PC controlled and allows a great deal of flexibility on all functions.
- Windows © operating system.
- Wide monitor and industrial keyboard.
- Menu program for cutting, drilling and scribing (linear and circular interpolation).
- Machine diagnostic.
- Machine hood & lifting and locking safety switches.
- Work recipes storing and data logging.
Wide monitor with user-friendly interface
HEAD
LASER SOURCE
- High power semisealed CO₂ Laser 350-1000W type Rf333.
- Gas CO₂ plasma tubesmounted on a frame with a granite plane to ensure high output power stability.
- RF excitement technology, high peak power, high frequency modulation, compactness.
- Free factory service with easy gas cartridge replacement.
- Frequency and pulse width programmable and real-time controlled by the electronic control.
CO₂ laser source
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OTHER OPTIONS
ALS200 with automatic loading/unloading system
- PRS vision system for automatic substrate alignment.
- Water chiller (stand-alone).
- Exhaust aspiration and filtering.
- Automatic loading/unloading system from magazine for substrate up to 6”x6”, two stack/rack magazines, one for loading, one for unloading.
- Working table holder with quick chuck locking system.
Automatic loading/unloading system
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MAIN TECHNICAL SPECIFICATIONS
| LASER SOURCE | |
| Wavelength | 10.6 µm |
| Rated power | 350 W (Continuous mode) |
| Peak output power | 850 W |
| X-Y TABLE (X-Y linear drive work table, optical linear encoders) | |
| Stroke | 300×300 mm |
| Speed | Up to 500 mm/s |
| Max substrate size | 6”x6” |
| Max thickness (AL₂O₃) | Up to 2 mm |
| Standard cutting speed | 4÷7 mm/s |
| Standard scribing speed | 100÷200 mm/s |
| DIMENSIONS&UTILITIES | |
| Dimensions (with manual loading) | 980W x 2620L x 1800H mm |
| Dimensions (with loader/unloader) | 1460W x 2620L x 1800H mm |
| Weight (with manual loading) | 1500 kg |
| Weight (with loader/unloader) | 1700 kg |
| Compressed air supply | 6 bar, 150 Nl/min |
| Power | 230V, 1ph, 50 Hz |
| Exhaust pipe diameter | 60 mm. Other on request |




