THICK FILM HYBRID CIRCUITS

THICK FILM HYBRID CIRCUITS ON ALUMINA & ALUMINIUM NITRIDE

Since 40 years, AUREL is leader in thick film technology.

AUREL can design and mass produce Thick Film Hybrid Circuits on Alumina ( Al2O3)  and on Aluminium Nitride (AlN) on complex geometry substrates, also provided with laser made metal coated pass-thru holes.

Alumina subtrate high thermal and mechanical stability is extremely suitable for chip & wire components.

Thick film hybrid circuits

Using last generation screen printing machines, AUREL can reach a very high integration density (net lines up to 150um) providing a very high reliability on the products.

BENEFITS

Thick film technology  is one of the most efficient technologies to assemble electronic circuits, offering the following possibilities:

  • Very dense interconnection nets on thermically conductive substrates
  • Low cost multilayer structures
  • High performance resistors via screen printing
  • Full functional trimming of assembled circuits in automatic stations
  • High circuit integration levels

Thick film Technology versatility is offering economical solution in several application fields:

  • automotive – avionics
  • consumer products – information technology
  • sensors – biomedical
  • telecommunications, research

AUREL is able to design and product many type of thick film hybrid circuits, for the most several application:

  • Single in Line hybrid circuits (SIL)
  • Dual in Line hybrid circuits (DIL)
  • Double face hybrid circuits
  • Double face hybrid circuits with plated holes
  • Radio Frequency hybrid circuits
  • Hybrid circuits for power applications
  • Hybrid circuits for power applications
  • Hybrid circuits with Die components
  • Hybrid circuits with mixed technology
  • Multilayer hybrid circuits
  • Thick film sensors and remain resistive
  • Protection and encapsulation of the hybrid circuits

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